GEEKTC GL-4500 Thermal Putty, Soft Laptop-Friendly Gap Filler, (30 g) Non-Conductive Thermal Compound, Moldable Putty for VRAM SSD MOSFETs Coils Console Graphics Card

Key features

• [SOFT LAPTOP-FRIENDLY THERMAL PUTTY] GEEKTC GL-4500 is a soft, moldable thermal putty designed for laptop cooling gaps, VRAM, SSDs, MOSFETs, coils, graphics cards, and console components. Its easy-compression texture is especially suitable for low-pressure heatsink structures commonly found in laptops.
• [HELPS PREVENT HEATSINK LIFT FROM HARD MATERIALS] Thermal materials that are too thick or too hard may lift the heatsink, reduce main chip contact, and lead to poor cooling. GL-4500 compresses more easily to fit uneven component heights, helping the heatsink sit properly while filling surrounding gap areas.
• [REALISTIC 4.5 W/m·K THERMAL CONDUCTIVITY] GL-4500 provides typical thermal conductivity of 4.5 W/m·K, density of 3.25 g/cm³, and minimum bond line thickness of 0.06 mm. The 4.5 W/m·K value is based on material test data, providing practical and reliable heat transfer without inflated marketing claims.
• [LONG-LASTING & ANTI-DRYING FORMULA] The putty formula is designed for long-term stability, helping resist drying, cracking, and performance drop over time. It helps maintain thermal contact in gap-filling areas for longer-lasting cooling performance. Not intended for direct CPU or GPU die applications; use GEEKTC thermal paste or GEEKTC PCM phase change material for main chip cores.
• [NON-CONDUCTIVE & NON-CORROSIVE] GL-4500 is electrically non-conductive and designed to be safe around electronic components when applied properly. It is also non-corrosive to electronic components, making it suitable for use around sensitive PCB areas.