UPSIREN UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (100, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling

Key features

• NOT SUITABLE FOR CPU: 14.8 W/mK high‑conductivity thermal putty, works as replacement for soft thermal pads, fills gaps for GPU, VGA and memory IC chips.
• NON‑CONDUCTIVE & SAFE: Halogen‑free and RoHS compliant formula prevents short‑circuit risk, delivers stable performance under high‑temperature working conditions.
• LOW VISCOSITY & MOLDABLE: Tacky flexible texture fits uneven surfaces. Supports auto‑dispensing equipment and stencil screen‑printing application scenarios.
• NO DRY‑OUT PERFORMANCE: Fully cured thermal material will not dry out over time, great for electronic assembly, rework and field repair projects.
• GAP‑FILLING COST‑SAVER: Compresses well to fill gaps compared with rigid thermal pads, practical for PC modders and electronics maintenance technicians.